Method of assembling a semiconductor device using a magnet

Details Method of assembling a semiconductor device using a magnet Method of assembling a semiconductor device using a magnet

1997-09-23

1998-11-10

Graybill, David

Semiconductor device manufacturing: process

Having magnetic or ferroelectric component

438119, 438123, 438760, H01L 2152, H01L 2156, H01L 21603

Patent

active

058343202

ABSTRACT:
Process for maintaining lead positions within a glass layer of a CQFP semiconductor device by using a magnet during high temperature assembly operations. During lead embed, a magnet (46) is magnetically attached to lead frame (44). Upon reflow of a glass layer (48), leads (50) sink into the glass layer to a height controlled by the height (H) of a protrusion (52) of the magnet. A similar magnet (62) can be used to maintain the lead positions during a high temperature operation used to cure a die attach material (60). Yet another magnet (70) can be used to maintain the positions of leads (50) during a lid seal operation. A common magnet design for use in all thermal operations can instead be used. Use of the magnets restrict movement of the leads within the glass layer when the glass is in a softened state.

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