Method of assembling a semiconductor component and apparatus...

Details Method of assembling a semiconductor component and apparatus... Method of assembling a semiconductor component and apparatus...

2006-09-05

2006-09-05

Lindsay, Jr., Walter L. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000, C438S613000

Reexamination Certificate

active

07101736

ABSTRACT:
A method of assembling a semiconductor component includes providing a pedestal, placing a first piece on the curved pedestal, wherein the first piece comprises a semiconductor die, placing a second piece over the first piece, and providing an adhesive between the first piece and the second piece. The method further includes applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece, and applying heat with a second plate to reflow the adhesive, wherein applying heat is performed simultaneously with applying pressure.

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