Method of assembling a sealed thermal interface

Details Method of assembling a sealed thermal interface Method of assembling a sealed thermal interface

2011-06-07

2011-06-07

Bryant, David P (Department: 3726)

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

C165S046000, C165S185000, C361S704000, C361S705000

Reexamination Certificate

active

07954236

ABSTRACT:
A sealed thermal interface component minimizes or eliminates the exudation of fluids, such as silicone oils, while preserving the excellent thermal conductivity of silicon-based thermal pad materials and enhancing the conformability of the component. In preferred embodiments, a foam frame surrounds a plurality of thermal pad portions formed of conformable thermal management material that may exude fluid under elevated temperatures or over time. Film encapsulates the foam-framed thermal pad portions, forming a sealed and partially evacuated thermal interface component. In one embodiment of the invention, the thermal pads are formed of an elastomeric matrix material containing silicone, the foam frame is made of urethane, and the film is made of polyurethane.

REFERENCES:
patent: 3928907 (1975-12-01), Chisholm
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4299715 (1981-11-01), Whitfield et al.
patent: 4466483 (1984-08-01), Whitfield et al.
patent: 4473113 (1984-09-01), Whitfield et al.
patent: 4602678 (1986-07-01), Fick
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4654754 (1987-03-01), Daszkowski
patent: 4685987 (1987-08-01), Fick
patent: 4764845 (1988-08-01), Artus
patent: 4782893 (1988-11-01), Thomas
patent: 4842911 (1989-06-01), Fick
patent: 4869954 (1989-09-01), Squitieri
patent: 4965699 (1990-10-01), Jorden et al.
patent: 4974119 (1990-11-01), Martin
patent: 4979074 (1990-12-01), Morley et al.
patent: 5060114 (1991-10-01), Feinberg et al.
patent: 5137959 (1992-08-01), Block et al.
patent: 5151777 (1992-09-01), Akin et al.
patent: 5167851 (1992-12-01), Jamison et al.
patent: 5194480 (1993-03-01), Block et al.
patent: 5205348 (1993-04-01), Tousignant et al.
patent: 5213868 (1993-05-01), Liberty et al.
patent: 5250209 (1993-10-01), Jamison et al.
patent: 5298791 (1994-03-01), Liberty et al.
patent: 5309320 (1994-05-01), Smith
patent: 5321582 (1994-06-01), Casperson
patent: 5359768 (1994-11-01), Haley
patent: 5471027 (1995-11-01), Call et al.
patent: 5510174 (1996-04-01), Litman
patent: 5533256 (1996-07-01), Call et al.
patent: 5545473 (1996-08-01), Ameen et al.
patent: 5679457 (1997-10-01), Bergerson
patent: 5766740 (1998-06-01), Olson
patent: 5790376 (1998-08-01), Moore
patent: 5798171 (1998-08-01), Olson
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6096414 (2000-08-01), Young
patent: 6397450 (2002-06-01), Ozmat
patent: 6946190 (2005-09-01), Bunyan
patent: 7004244 (2006-02-01), Rauch
patent: 7063127 (2006-06-01), Gelorme et al.
patent: 7137444 (2006-11-01), Faybishenko et al.
patent: 7568255 (2009-08-01), Krebs
patent: 7682690 (2010-03-01), Bunyan et al.
Fujipoly—Sarcon Thermal Interface Materials; Fujipoly—A ISO9000 Registered Company; (3 pages); (Jan. 18, 2007);http://www.fujipoly.com/products/genProductLine.asp?ProductLine=SarconThermal-Interface-Materials.
The Bergquist Company; Thermal Materials: Thermal Properties and Testing; (Jan. 18, 2007); 3 pages; http://www.bergquistcompany.com/tm-thermal-prop.cfm.
The Bergquist Company; Compressive Modulus of Elasticity for Gap Pad® Materials; (5 pages); Benno Shuhbauer and Kevin Hanson; (May 3, 1999).
The Bergquist Company; Thermal Materials: Sil-Pad Products; (3 pages); http://www.bergquistcompany.com/tm—sil—pad—list.cfm, 2007.
The Bergquist Company; Thermal Materials: Gap-Pad Products; (2 pages); http://www.bergquistcompany.com/tm—gap—pad—list.cfm, 2007.
Dow Corning; Thermal Interface—Pads and Films; Thin Thermal Interface Materials Overview; (Fomerly Known as Heat Path™); http://www.dowcorning.com/content/etronics/etronicspadsfilm/etronics—tcpad—thinov.asp; (2 pages), 2007.
Dow Corning; Product Information; Information about Dow Corning® Brand Thermal Interface Pads and Films; (8 pages), 2003.
Dow Corning; Thermal Interface—Pads and Films; http:www.dowcorning.com/content/etronics/etronicspadsfilm/default.asp; (2 pages, 2007.
Dow Corning; Thermal Interface—Pads and Films; Gap Filler thermal Interface Materials Overview; http://www.dowcorning.com/content/etronicspadsfilm/etronics—tcpad—gapov.asp; (2 pages), 2007.
W. L. Gore & Associates—Electronics Products Division; Gore™ Polarchip™ CP8000 Thermal Interface Material Brochure; © 2003 W.L. Gore & Associates; (1 page), 2007.
Gore Creative Technologies Worldwide; CP8000 Thermal Interface Material Product Technical Details—POLARCHIP CP8000 Thermal Interface Material Properties; http://www.gore.com/en—xx/products/electronic/speciality/cp8000—therm—int—mtrl—tech+dtls.html; (3 pages), 2007.
Core Creative Technologies Worldwide; CP6000 Thermal Interface Material Product Technical Details;http://www.gore.com/en—xx/products/electronic/speciality/m20—therm—int—mtrl—prod—tech—dils.html; (3 pages), 2007.
Gore Creative Technologies Worldwide; Thermal Interface Materials; CP6000 and CP8000; http://www.gore.com/en—xx/products/electronic/speciality/thermal—interface—materials.html; (2 pages), 2007.
Laird Technologies; T-flex™ 600 Series Thermal Gap Filler; Engineered emi, antenna and Thermal applications; www.lairdtech.com; (3 pages), 2007.
Laird Technologies; Corporate Overview Brochure; http://ww.lairdtech.com/pages/catalogs/thermal.asp; (17 pages), 2007.
3M Thermal Management Solutions for Electronics Brochure; (6 pages), 2005.
3M Thermally conductive Interface Pad 5591s; Technical Data; Aug. 2006; (4 pages).
3M Thermally Conductive Interface Pad 5592/5592s; Aug. 2006; (4 pages).
3M Thermally Conductive Interface Pad 5595/5595s; Aug. 2006; (4 pages).

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