Method of assembling a microcircuit with face-mounted leads

Details Method of assembling a microcircuit with face-mounted leads Method of assembling a microcircuit with face-mounted leads

1978-04-12

1980-02-19

Husar, Francis S.

Metal fusion bonding

Process

With shaping

29591, B23K 112, H01L 2128

Patent

active

041890850

ABSTRACT:
A method of assembling a packaged microcircuit with face-mounted leads includes forming a lead frame into a holder with opposed sets of leads turned upward and angular to spaced apart carrier strips, and securing a substrate having a microcircuit thereon within the holder with one set of leads securely held in contact with terminals on a face of the substrate, so that bonded electrical connections between the leads and the terminals can be readily made with conventional soldering techniques.

REFERENCES:
patent: 3417193 (1968-12-01), Cole
patent: 3474521 (1969-10-01), Schwenn
patent: 4003125 (1977-01-01), Wallick
patent: 4012835 (1977-03-01), Wallick
patent: 4024627 (1977-05-01), Stauffer
patent: 4054238 (1977-10-01), Lloyd et al.

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