Method of assembling a heat sink assembly

Details Method of assembling a heat sink assembly Method of assembling a heat sink assembly

1996-06-25

1999-10-05

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438118, 438119, 438121, H01L 23367, H01L 2144

Patent

active

059637951

ABSTRACT:
Method of cooling electronic systems an semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element having a generally flat shape with a shoulder projecting from one generally flat surface, and configured to thermally engage similar elements. In one embodiment, a first and a second heat sink element are provided, with one of the first and second elements having a protrusion and the other of the first and second elements defining a depression configured to receive and retain said protrusion. Alternatively, the first and second elements may be bonded together with a thermally conductive adhesive.

REFERENCES:
patent: 2414801 (1947-01-01), Clarke
patent: 3205936 (1965-09-01), Katz
patent: 3372733 (1968-03-01), Callender
patent: 3388739 (1968-06-01), Olson et al.
patent: 3413532 (1968-11-01), Boyer
patent: 3457988 (1969-07-01), Meyerhoff et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4141030 (1979-02-01), Eisele et al.
patent: 4158719 (1979-06-01), Frantz
patent: 4340902 (1982-07-01), Honda et al.
patent: 4345267 (1982-08-01), Corman et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4404582 (1983-09-01), Pollard et al.
patent: 4471837 (1984-09-01), Larson
patent: 4535384 (1985-08-01), Wakabayashi
patent: 4563725 (1986-01-01), Kirby
patent: 4587550 (1986-05-01), Matsuda
patent: 4669535 (1987-06-01), Seidler
patent: 4729061 (1988-03-01), Brown
patent: 4733293 (1988-03-01), Gabuzda
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 4810289 (1989-03-01), Hoyer et al.
patent: 4849856 (1989-07-01), Funari et al.
patent: 4849857 (1989-07-01), Butt et al.
patent: 4890194 (1989-12-01), Derryberry et al.
patent: 4909841 (1990-03-01), Iyer et al.
patent: 4941067 (1990-07-01), Craft
patent: 4954170 (1990-09-01), Fey et al.
patent: 4996629 (1991-02-01), Christiansen et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5057903 (1991-10-01), Olla
patent: 5172301 (1992-12-01), Schneider
patent: 5175612 (1992-12-01), Long et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5293930 (1994-03-01), Patasi
patent: 5310520 (1994-05-01), Jha et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5514327 (1996-05-01), Schneider
patent: 5654587 (1997-08-01), Schneider et al.
patent: 5693981 (1997-12-01), Scheineder et al.
Akira Suzuki; Abstract; Manufacture of Heat Sink For Semiconductor; Pat. No. 54-25168.
Hisashi Yoshida; Abstract; Semiconductor Device; Pat. No. 59-117244.
Noriyuki Ashiwake; Abstract; Radial Flow Heat Sink and Semiconductor Cooler Using The Same; Pat. Nos. 2-73657.

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