Method of arranging alignment marks

Details Method of arranging alignment marks Method of arranging alignment marks

1996-12-04

1998-02-10

Tsai, Jey

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

438946, 438975, H01L 2176

Patent

active

057168890

ABSTRACT:
A shot region includes a device region for forming a semiconductor device therein and a dicing region used for dicing. A portion of the peripheral edge portion of the shot region is defined by a portion of the peripheral edge portion of the device region. An alignment mark is arranged within the device region, and additional alignment marks are arranged within the dicing region. Thus, the number of the devices manufactured per wafer can be increased without degrading precision of alignment.

REFERENCES:
patent: 5316966 (1994-05-01), Van Der Plas et al.
patent: 5504999 (1996-04-01), Barr
patent: 5525840 (1996-06-01), Tominaga

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