Method of applying thin metal deposits to a substrate

Details Method of applying thin metal deposits to a substrate Method of applying thin metal deposits to a substrate

1980-02-28

1981-10-27

Smith, John D.

Coating processes

Electrical product produced

Condenser or capacitor

427 92, 427 93, 427304, 427305, 4273833, C23C 302, H01L 21288

Patent

active

042973937

ABSTRACT:
A method of applying thin metal sensitizing deposits to the exposed silicon areas of a silicon substrate having areas of exposed silicon and silicon oxide, including the steps of immersing the silicon substrate in a basic, aqueous solution containing a metal salt of the metal to be deposited, particularly a nickel, cobalt, or platinum salt, and thereafter reducing the metal ion of the salt to the elemental metal by use of the exposed silicon as the reducing agent.

REFERENCES:
patent: 3630767 (1971-12-01), Linstedt et al.
patent: 3632436 (1972-01-01), Denning
patent: 3856565 (1974-12-01), Arnold
patent: 3949120 (1976-04-01), Leibfried
patent: 3963523 (1976-06-01), Tanaka et al.
patent: 4039698 (1977-08-01), Fraser et al.
patent: 4228201 (1980-10-01), Feldstein

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