Method of applying solder

Details Method of applying solder Method of applying solder

1992-05-22

1993-05-18

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228219, 427 96, 427266, B23K 120, H01L 2160

Patent

active

052113280

ABSTRACT:
A method of precisely depositing accurately defined quantities of solder onto high density circuit patterns on a substrate without use of a solder mask or the like wherein solder paste is originally deposited within a precisely defined transfer member (e.g., graphite block having holes drilled therein), the transfer member then being aligned relative to the respective circuitry such that when both block and substrate are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors, the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.

REFERENCES:
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patent: 3583063 (1971-08-01), Growney
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IBM Technical Disclosure Bulletin vol. 19, No. 8, Jan. 1977, "Tinning Preplated Sites On A Substrate", by Herdzik et al.
IBM Technical Disclosure Bulletin vol. 28, No. 2, Jul. 1985, "Method For Applying Solder Paste On Non-Planar Boards", by Curtis et al.
Insulation/Circuits, vol. 26, No. 11, pp. 51-52, "New Concept Involving Solder Flowing Through Precisely Placed Holes in Plastic Film Useful for High Density Connections".
Soldering Manual American Welding Society, Inc. Miami, Florida (1977) p. 131.

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