Method of applying phase change thermal interface materials

Details Method of applying phase change thermal interface materials Method of applying phase change thermal interface materials

2006-03-21

2006-03-21

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S620000, C029S607000, C029S890030, C029S890032, C156S306300, C257SE23089, C257SE23107, C438S781000, C438S782000

Reexamination Certificate

active

07013555

ABSTRACT:
The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.

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