Method of applying miniaturized high-temperature free-grid strai

Details Method of applying miniaturized high-temperature free-grid strai Method of applying miniaturized high-temperature free-grid strai

1977-04-14

1978-09-19

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29423, 29610SG, 156344, 156249, 338 2, B32B 3100

Patent

active

041151747

ABSTRACT:
A method of applying miniaturized high-temperature free-grid strain gauges to a test location by welding an auxiliary temporary backing to a strain gauge equipped with supporting or backing foil and connecting excess-length connecting webs thereto for manipulation of the gauge. Thereafter, the strain gauge is adhered, grid side facing downwardly, to a porous backing by means of an adhesive, the backing foil is then stripped off and the adhesive dissolved by a chemical solvent. The strain gauge is then applied to the test location and affixed thereto.

REFERENCES:
patent: 2626338 (1953-01-01), Mitchell
patent: 2899658 (1959-08-01), Bean
patent: 2927878 (1960-03-01), Beckman
patent: 3082139 (1963-03-01), Clark
patent: 3121491 (1964-02-01), Weymouth
patent: 3698976 (1972-10-01), Ake et al.

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