Method of applying an integrated circuit on a substrate having a

Details Method of applying an integrated circuit on a substrate having a Method of applying an integrated circuit on a substrate having a

1986-09-23

1988-03-08

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 2281802, 427 96, H05K 310

Patent

active

047291656

ABSTRACT:
A method for producing adhesive contacting of an IC on a substrate of a LC cell, comprising suspending the leads of the IC, in the opening of an insulating frame by means of the leads surrounding the leads with conductive adhesive and adhesively securing them on the substrate by means of the frame.

REFERENCES:
patent: 3614832 (1971-10-01), Chance
patent: 3838984 (1974-10-01), Crane et al.
patent: 4038744 (1977-08-01), Cheype et al.
patent: 4184043 (1980-01-01), Hildering
patent: 4631820 (1986-12-01), Harada et al.
patent: 4635354 (1987-01-01), Chrobak et al.

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