Method of applying an electrical conductor pattern on an apertur

Details Method of applying an electrical conductor pattern on an apertur Method of applying an electrical conductor pattern on an apertur

1982-11-12

1985-06-11

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156240, 156289, 156293, 156277, 29602R, 336200, B44C 114, B32B 3100, B29C 1900, H01F 706

Patent

active

045226717

ABSTRACT:
To make inductance elements, thick film electrically conductive paste, which may include precious metal such as silver, are applied by a deformable stamp on a ferrite core which, for example, can be someone hump shaped, for adhesion to a carrier (30) and formed with openings thereto, the stamp being shaped to fit within the opening and deforming to penetrate the opening to apply the thick film conductive paste in form of conductive tracks thereon. Conductive tracks can be applied, previously, to a substrate carrier (30), which are then joined by the paste strips to form interconnected windings (FIGS. 1a, 1b); or the ferrite may be in form of a toroidal core (34), on which the conductive tracks are applied around all surfaces, to form connected windings thereon, the deformable stamp having a projecting tip which can fit within the opening of the toroidal core.

REFERENCES:
patent: 3701317 (1972-10-01), Miyamoto et al.
patent: 3833872 (1974-09-01), Marcus et al.
patent: 3858138 (1974-12-01), Gittleman et al.
patent: 3887420 (1975-06-01), Weingrad
patent: 3932251 (1976-01-01), Tanaka
patent: 4117588 (1978-10-01), Johnson
patent: 4264647 (1981-04-01), Trevorrow
patent: 4347113 (1982-08-01), Fischer et al.
patent: 4392905 (1983-07-01), Boyd et al.

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