Method of applying an adhesive to a circuit chip

Details Method of applying an adhesive to a circuit chip Method of applying an adhesive to a circuit chip

1981-05-04

1982-08-24

Smith, John D.

Coating processes

Electrical product produced

Condenser or capacitor

427 96, 4272071, 118265, H01L 2158

Patent

active

043461247

ABSTRACT:
A method for applying an epoxy glue, solder paste or a similar material to the surface of a planar circuit chip, such as a silicon integrated circuit chip. Positioned just above the liquid epoxy in the bath is a fine mesh, stainless steel screen clamped at its periphery and having supported thereover a leveling paddle with a micrometer adjustment rotatable relative to the bath itself for smoothing the material over the screen surface. After this smoothing or leveling operation, the chip, usually held by a vacuum chuck, is pressed against the screen into the epoxy with the screen functioning as a resilient means enabling the chip to be withdrawn therefrom with uniform deposition of material applied to the undersurface thereof. The apparatus may also have a spongy material such as polyurethane or a sponge neoprene rubber under the screen to enhance chip removal.

REFERENCES:
patent: 3638304 (1972-02-01), Bleil
patent: 3963551 (1976-06-01), Marlinski
Towers, T. D., Hybrid Microcircuits, Crane, Russak and Company, Inc., N.Y., 1977, pp. 20 to 23.

Affiliated with

Also associated with

Rating

Method of applying an adhesive to a circuit chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of applying an adhesive to a circuit chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of applying an adhesive to a circuit chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1436971