Printing – Stenciling – Processes
Reexamination Certificate
2000-07-05
2002-04-02
Yan, Ren (Department: 2854)
Printing
Stenciling
Processes
C101S127000, C118S213000, C427S282000
Reexamination Certificate
active
06363847
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of applying an adhesive material to a parts mounted circuit board.
2. Description of the Prior Art
Parts are sometimes mounted on a printed circuit board at several times. When mounting next parts on the mounted circuit board, an adhesive material is applied to a position at which the next parts are mounted, however, this application has been conventionally performed one by one by a manual operation. Further, it is a significantly difficult operation to apply the adhesive material in a spot manner between the mounted parts. Accordingly, the applying operation is troublesome, thereby deteriorating an efficiency of a whole of the mounting process.
SUMMARY OF THE INVENTION
The present invention is made by taking the points mentioned above into consideration, and an object of the present invention is to provide a method of applying an adhesive material to a parts mounted circuit board in which an application of an adhesive material is performed by printing so as to apply the adhesive material to a large number of parts mounted circuit plate at one time, solve a troublesomeness in the case of manually applying in a spot manner and greatly improve an efficiency of a whole of the mounting process.
Therefore, in accordance with the present invention, there is provided a method of applying an adhesive material to a parts mounted circuit board, wherein a recess portion surrounding a part of a circuit board in which the parts are already mounted is provided on a back surface, a portion corresponding to a position at which the parts of the circuit board should be mounted is protruded in the recess portion, a mask having a through hole for applying the adhesive material in the protruding portion is used, and the adhesive material is applied by screen printing.
REFERENCES:
patent: 4678531 (1987-07-01), Metzger et al.
patent: 5368883 (1994-11-01), Beaver
patent: 5373786 (1994-12-01), Umaba
patent: 5704287 (1998-01-01), Omori et al.
patent: 5740730 (1998-04-01), Thompson, Sr.
patent: 6272984 (2001-08-01), Kato et al.
Coleman Henry D.
Minami Co. Ltd.
Sapone William J.
Sudol R. Neil
Yan Ren
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