Method of applying a tacking agent to a printed circuit board

Details Method of applying a tacking agent to a printed circuit board Method of applying a tacking agent to a printed circuit board

1995-02-03

1996-03-19

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228223, 22818022, 228175, 427 96, 427155, 118505, B23K 3102, H05K 334

Patent

active

054997569

ABSTRACT:
A method of applying a tacking agent to a printed circuit board. The printed circuit board (10) has a number of solder pads (12), and each solder pad is preclad with a layer of solder (14) between 0.02 and 0.3 mm thick. A plastic film (16) is temporarily adhered to the printed circuit board by a pressure sensitive adhesive. The plastic film has a number of apertures (22) that correspond to the solder pads, and is positioned so that the apertures in the film expose the solder coated pads. There is a breakaway tab (20) on the plastic film that is used to peel the film from the printed circuit board in a later operation. The film is roller coated with a high viscosity tacking agent (30) so that a layer of the tacking agent is applied to the exposed interconnect pads. The plastic film is then peeled cleanly away from the printed circuit board using the breakaway tab, leaving the tacking agent only on the solder pads. An electronic component (35) can then be placed on the printed circuit board in contact with the coated solder pads. The printed circuit board and the electronic component can then be heated to reflow the clad solder and form a solder joint between the solder pads and the component.

REFERENCES:
patent: 4946524 (1990-08-01), Stumpf et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5172853 (1992-12-01), Maiwald
patent: 5177134 (1993-01-01), Mullen, III et al.
patent: 5271548 (1993-12-01), Maiwald
patent: 5315070 (1994-05-01), Maiwald
patent: 5435481 (1995-07-01), Da Costa Alves et al.

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