Method of applying a polymer thick-film resistive paste for...

Coating processes – Electrical product produced – Resistor for current control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S097700, C427S356000

Reexamination Certificate

active

07575778

ABSTRACT:
The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.

REFERENCES:
patent: 5027703 (1991-07-01), Hancy
patent: 5685221 (1997-11-01), Newman
patent: 5826516 (1998-10-01), Shimazu et al.
patent: 6030553 (2000-02-01), Huang et al.
patent: 6237490 (2001-05-01), Takahashi et al.
patent: 6335055 (2002-01-01), Miyahara et al.
patent: 6923117 (2005-08-01), Onishi et al.
patent: 08-282080 (1996-10-01), None
patent: 09-239955 (1997-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of applying a polymer thick-film resistive paste for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of applying a polymer thick-film resistive paste for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of applying a polymer thick-film resistive paste for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4101630

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.