Method of applying a pattern to a surface of a substrate

Details Method of applying a pattern to a surface of a substrate Method of applying a pattern to a surface of a substrate

1999-03-19

2000-07-04

Beck, Shrive

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427596, 427286, 427424, 427425, 118315, 118320, 118321, 216 94, B05D 140

Patent

active

060835710

ABSTRACT:
A method of applying a pattern to a surface of a substrate includes forming mutually parallel pattern rows applied by at least two output channels. In order to produce a pattern without strip-like visible faults, provision is made for the output channels in each case to be displaced transversely in relation to the pattern rows such that pattern rows can optionally be applied by at least some of the output channels in order to obtain a complete pattern. The individual pattern rows are applied by different output channels and are mixed with one another.

REFERENCES:
patent: 5373137 (1994-12-01), McLaughlin
patent: 5645895 (1997-07-01), Murayama et al.
patent: 5662968 (1997-09-01), Yamaguchi
patent: 5707689 (1998-01-01), Hori

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