Method of applying a layer of conductive ink

Coating processes – Electrical product produced

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 79, 427122, 101 35, 101 41, B05D 512, B41F 1700

Patent

active

045087555

ABSTRACT:
Electret transducers, for example microphones, have a backplate which is metallized on one surface, the metallized surface forming one side of a capacitor. A frame sits on the metallized tape to hold the tape taut over the backplate. Metal connections are made to the backplate and frame to complete the circuit. The metallization is conventionally formed by vapor deposition of aluminum. This is a lengthy and relatively expensive process. Also the metallization can give rise to galvanic problems. The invention prints a pattern of conductive ink on the various parts. Good contact is obtained, galvanic action avoided and a reduction in manufacturing costs occurs. Simplified assembly is also obtained.

REFERENCES:
patent: 3701317 (1972-10-01), Miyamoto
patent: 4249043 (1981-02-01), Morgan et al.
patent: 4382328 (1983-05-01), Janszen
patent: 4389459 (1983-06-01), Mirra et al.
patent: 4403547 (1983-09-01), Forberger

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of applying a layer of conductive ink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of applying a layer of conductive ink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of applying a layer of conductive ink will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1090872

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.