Method of applying a dielectric layer to a substrate and a mask-

Details Method of applying a dielectric layer to a substrate and a mask- Method of applying a dielectric layer to a substrate and a mask-

1978-06-19

1980-02-12

Smith, Ronald H.

Coating processes

Heat decomposition of applied coating or base material

Coating decomposed to form metal

427162, 427166, 427248R, 427255, 427259, 427264, 427269, 427282, 427287, 427376G, B05D 302

Patent

active

041884175

ABSTRACT:
A method of applying a dielectric layer to a substrate, comprises applying a metallic suspension, for example, a layer of so-called "conducting silver" which is a suspension of silver particles in an organic binder or solvent to the substrate surface in an area which is not to receive the dielectric layer so as to form a mask. The organic binder or solvent is advantageously decomposed by heating so as to leave the metallic deposit mask. Thereafter, a layer of dielectric material is applied over the substrate in the areas which are not covered by the mask and, subsequently, the mask is removed, such as by dissolving it. A mask-forming coating for the application of the dielectric layers on the substrate comprises a metallic suspension which may be in the form of a lacquer-type liquid or paste which contain noble metals, for example, in the form of tinsels as the conducting constituent and also include organic binders or solvents of various kinds.

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patent: 3779807 (1973-12-01), Taylor et al.
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patent: 4027052 (1977-05-01), Thompson
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patent: 4073981 (1978-02-01), Baron
patent: 4088799 (1978-05-01), Kurtin

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