Method of application of a conforming mask to a printed circuit

Radiation imagery chemistry: process – composition – or product th – Stripping process or element – Forming nonplanar image

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Details

430319, 430327, 430328, 430330, G03C 1112

Patent

active

051642840

ABSTRACT:
A dry film for forming a solder mask includes a cover sheet, a photoimageable composition layer which is curable to form a solder mask and a top coat interposed between the cover sheet and the photoimageable composition layer which is selectively adherent to the photoimageable composition layer. The dry film is applied to a surface of a printed circuit board. With heat, vacuum and mechanical pressure, the photoimageable composition layer is laminated to the irregular surface of the printed circuit board, partially conforming the photoimageable composition layer to the contours thereof. Within about 60 seconds and with the photoimageable composition layer still heated, the cover sheet is peeled away, leaving the top coat as a protective covering over the photoimageable composition layer. Removal of the cover sheet allows the photoimageable composition layer to fully conform to the contours of the printed circuit board. Immediately thereafter, the circuit board is cooled to about ambient temperature or below. The photoimageable composition layer is exposed to patterned actinic radiation, developed, and cured to form a hard, permanent solder mask.

REFERENCES:
patent: 4127436 (1978-11-01), Friel
patent: 4530896 (1985-07-01), Christensen et al.
patent: 4889790 (1989-12-01), Roos et al.

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