Method of aperturing thin sheet materials

Details Method of aperturing thin sheet materials Method of aperturing thin sheet materials

1996-09-23

1998-04-07

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 156268, 1565802, 264444, 83956, B32B 3118

Patent

active

057359849

ABSTRACT:
A method of forming apertures generally greater than about 0.05 square millimeters in a thin sheet material. The thin sheet material includes a first side and a second side at least one side of the thin sheet material is substantially coated with an adhesive. The method comprises the steps of (a) placing the adhesive-coated thin sheet material on a patterned anvil having a pattern of raised areas wherein the height of the raised areas is equal to or less than the thickness of the thin sheet material and the adhesive; and (b) subjecting the thin sheet material to a sufficient amount of sonic vibrations to aperture the thin sheet material and the adhesive; and whereby the thin sheet material and the adhesive is apertured in a pattern generally the same as the pattern of raised areas on the patterned anvil.

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