Method of and system for cleaning probes

Details Method of and system for cleaning probes Method of and system for cleaning probes

2001-04-04

2003-04-22

Gulakowski, Randy (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S002000, C134S025100, C134S184000, C034S422000

Reexamination Certificate

active

06551408

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of cleaning probes fitted to a probe card for use in an electrical continuity test for a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer, and so forth, and a cleaning system for use in carrying out the method.
2. Related Art
In the case of conducting an electrical continuity test for a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer, a probe card provided with a plurality of probes fitted thereto is generally used.
When conducting the electrical continuity test, the probe card is used to cause the tip of the respective probes to come into contact with respective electrodes composed of aluminum, and the like, formed on the surface of the respective semiconductor integrated circuit devices.
Hereupon, as a thin oxide film is formed on the surface of the respective electrodes, the respective probes are set to be slidably in contact with the respective electrodes in order to remove the oxide film at the time of the contact with the respective electrodes. As a result, foreign particles composed of powders of metal such as aluminum, and the like, making up the electrodes, are caused to adhere to the surface of the respective probes.
Consequently, there has arisen a problem that electrical conductivity of the respective probes deteriorates due to the oxide film of the metal, adhered to the surface of the respective probes, and faulty contact between the respective electrodes and the respective probes results, making it impossible to conduct the electrical continuity test in a satisfactory manner. Accordingly, cleaning of the probe card has thus far been carried out in order to remove the foreign particles adhered to the surface of the respective probes.
Now, a conventional method of cleaning the probes is described hereinafter with reference to FIG.
5
. In
FIG. 5
, reference numeral
110
denotes one of the probes making up the probe card,
111
the foreign particles,
120
an abrasive sheet,
121
abrasive grains contained inside the abrasive sheet
120
, and
122
a sheet base material made of a silicone rubber.
In cleaning the probe
110
with the use of the abrasive sheet
120
, there has been adopted a practice whereby the probe
110
is caused to pierce the abrasive sheet
120
several times, and the foreign particles
111
adhered to the probe
110
are scraped off by the agency of the abrasive grains
121
contained inside the abrasive sheet
120
.
With such a method as described, however, a film of silicone rubber, a constituent material of the sheet base material
122
, adheres to the probe
110
, so that it has been necessary to apply an organic solvent to the probe
110
for removal of the film of silicone rubber, and further, to blow air thereto for drying the organic solvent.
Thus, with the conventional method of cleaning the probes, there are involved many steps of a cleaning process, such as scraping off of the foreign particles, application of the organic solvent, and the blowing of air, causing a problem that significant effort and time are required in carrying out these steps.
Further, since the organic solvent is used in the step of applying the organic solvent, a working environment has been anything but desirable to workers.
Furthermore, since the probe
110
is caused to pierce the abrasive sheet
120
to come into contact therewith, there has been a risk of the probe
110
undergoing deformation.
SUMMARY OF THE INVENTION
The present invention has been developed in view of such a circumstance as described in the foregoing, and it is therefore an object of the invention to provide a method of cleaning probes, capable of attaining reduction in the number of steps for a process of cleaning the probes, improvement in a cleaning environment, and less damage inflicted on the probes, and a cleaning device used for carrying out the method.
To this end, according to a first aspect of the invention, there is provided a method of cleaning a probe for removing foreign particles stuck to the probe, comprising the steps of: causing a standing wave comprising nodes and antinodes occurring in concentric circles to be generated inside a cylindrical body by subjecting the cylindrical body to ultrasonic vibration, and removing the foreign particles stuck to the surface of the probe by vibration of air occurring at the antinodes of the standing wave generated inside the cylindrical body by bringing the cylindrical body in close proximity to the probe.
Thus, since the foreign particles stuck to the surface of the probe are removed without contact by the effect of vibration of air occurring at the antinodes of the standing wave generated inside the cylindrical body by subjecting the cylindrical body to the ultrasonic vibration, it becomes possible to do away with troublesome work, which otherwise is required later on, such as removal of a film of silicone rubber by use of an organic solvent, work for drying the organic solvent by blowing air thereto, and so forth, thereby enabling simplification of work and shortening of work time as compared with a conventional case where the foreign particles are scraped off by causing the probe to pierce the abrasive sheet containing the abrasive grains. Further, since the organic solvent is unwanted, degradation in a working environment can be prevented. Furthermore, since the probe is cleaned by a non-contact method, cleaning can be carried out without causing problems such as deformation of the probe due to contact.
That is, excellent cleaning can be performed without inviting damage on the probe, and degradation in a working environment, which can otherwise occur at the time of cleaning, while reducing the number of steps for the process of cleaning the probe.
According to a second aspect of the invention, there is provided the method of cleaning the probe as set forth in the first aspect of the invention, wherein the cylindrical body is caused to undergo ultrasonic vibration at a plurality of varieties of resonance frequencies thereof.
That is, by causing the cylindrical body to undergo the ultrasonic vibration at the plurality of the varieties of resonance frequencies thereof, a plurality of varieties of standing waves are caused to be generated, and consequently, the number of nodes and antinodes of the standing waves generated inside the cylindrical body can be increased, thereby enabling cleaning of a plurality of the probes with ease.
As a result, a probe card comprising the plurality of the probes, for use in an electrical continuity test for a plurality of semiconductor integrated circuit devices, and so forth, can be cleaned with extreme ease and in short time.
That is, it becomes possible to significantly enhance a probability of the antinodes of the standing waves coinciding with a position of the respective probes so as to be able to cope with a tendency of a pitch among the probes becoming narrower accompanying narrowing down of a pitch among electrodes formed on the semiconductor integrated circuit devices, and a tendency of an increase in the number of the probes fitted to the probe card for application to a wafer in whole.
According to a third aspect of the invention, there is provided the method of cleaning the probe as in the first aspect or the second aspect of the invention, wherein the plurality of the probes are disposed so as to be arranged in line, and the cylindrical body is caused to make relative translation in the direction of a lineup of the probes as arranged.
More specifically, by causing the cylindrical body to make the relative translation in the direction of the lineup of the probes of the probe card provided with the plurality of the probes lined up, for use in conducting the electrical continuity test on the semiconductor integrated circuit devices, and the like, the foreign particles stuck to the respective probes can be removed smoothly and in short time by the agency of the standing waves generated inside the cylindrical body.
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