Method of and mechanism for peeling adhesive tape bonded to...

Details Method of and mechanism for peeling adhesive tape bonded to... Method of and mechanism for peeling adhesive tape bonded to...

2004-08-05

2009-12-15

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S345420, C438S464000

Reexamination Certificate

active

07631680

ABSTRACT:
An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.

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Notice of the Reasons for Rejection issued by the Japanese Patent Office on Sep. 24, 2008 for corresponding Japanese Patent Application No. 2002-271536, and English-language translation thereof.

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