Method of and device for producing multi-layer pipes

Details Method of and device for producing multi-layer pipes Method of and device for producing multi-layer pipes

1978-10-06

1981-01-27

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

72 49, 219 62, 228 9, 228 175, 228145, 228170, B23K 3106

Patent

active

042470331

ABSTRACT:
A method of and device for producing multi-layer pipes by helically winding a plurality of bands loosely arranged one above the other, which are individually withdrawn from a supply, straightened out, trimmed, and in the form of a band loop are conveyed to the forming station at the respective angle of lead-in corresponding to the respective pipe diameter, whereupon the layers are together welded to form a pipe strand which is subsequently cut into individual pipes. All bands are supplied and advanced independently of the irregularities of the respective longitudinal band edge shape in steadily straight lead-in directions, and all band edges are machined together to a possible maximum width in coordination with each other whereupon the bands are driven together while the welding gap is controlled in conformity with their band edge shape merely by pivoting the pipe.

REFERENCES:
patent: 1929415 (1933-10-01), Force
patent: 2318732 (1943-05-01), Yoder
patent: 3093103 (1963-06-01), Berkeley
patent: 3208138 (1965-09-01), Eckhardt
patent: 3267570 (1966-08-01), Winkler
patent: 3661314 (1972-05-01), Tselikov et al.
patent: 3845645 (1974-11-01), Gebaver

Affiliated with

Also associated with

Rating

Method of and device for producing multi-layer pipes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and device for producing multi-layer pipes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and device for producing multi-layer pipes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1177317