Method of and device for positioning electrical and/or electroni

Details Method of and device for positioning electrical and/or electroni Method of and device for positioning electrical and/or electroni

1982-02-04

1984-11-06

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

29743, 29759, 29834, 228 6A, 228 7, 228 47, 414736, 414737, H01L 2160

Patent

active

044807805

ABSTRACT:
For the mounting of electrical and/or electronic components on a substrate, the components are presented in a pick-up position in a fixed, invariable pattern, preferably in a straight row. The components are simultaneously picked up in this pattern by a number of transfer devices and simultaneously moved toward their mounting positions over the substrate. During this transfer, they are moved different distances into a modified pattern with respect to one another, which corresponds to the desired pattern in which the components are to be positioned on the substrate. The transfer devices are programmed by means of exchangeable program plates.

REFERENCES:
patent: 3958740 (1976-05-01), Dixon
patent: 4119211 (1978-10-01), Boyer et al.
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4307832 (1981-12-01), Taki et al.
patent: 4342090 (1982-07-01), Caccoma et al.

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