Method of and device for packaging electronic components...

Details Method of and device for packaging electronic components... Method of and device for packaging electronic components...

2002-11-25

2008-03-11

Pickett, J. Gregory (Department: 3728)

Package making

Methods

Filling preformed receptacle and closing

C053S473000, C053S255000

Reexamination Certificate

active

07340872

ABSTRACT:
The invention relates to a method of packaging an electronic component such as semiconductor device, where by the component is positioned in a cavity of a foil by tweezers and is supported by means of a further foil which is attached to the foil at one side thereof. According to an example embodiment, the component is first placed into the cavity of the foil by the tweezers, and only after that is the further foil positioned adjacent thereto and attached to the foil. The tweezers are moved through the foil to pick up the component, hold it, and move it into the cavity. A feature of this embodiment is that the component may be temporarily supported by a supporting means after being positioned in the cavity and before being attached to the further foil, and the foil with the component is moved in a longitudinal direction (L) of the foil.

REFERENCES:
patent: 4575995 (1986-03-01), Tabuchi et al.
patent: 5150787 (1992-09-01), Bird et al.
patent: 5203143 (1993-04-01), Gutentag
patent: 5524765 (1996-06-01), Gutentag
patent: 5589029 (1996-12-01), Matsui et al.
patent: 5857572 (1999-01-01), Bird et al.
patent: 6202292 (2001-03-01), Farnworth et al.
patent: 6370750 (2002-04-01), Matsumura et al.
patent: 10032415 (2001-10-01), None

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