Method of and apparatus for wafer-scale packaging of surface...

Details Method of and apparatus for wafer-scale packaging of surface... Method of and apparatus for wafer-scale packaging of surface...

2005-03-15

2005-03-15

Budd, Mark O. (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

Reexamination Certificate

active

06867535

ABSTRACT:
The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isolates elements of array transducers. Post processing of wafers consisting of transducers only on the top few microns of the wafer surface can be used to create a wafer scale packaging solution. By spinning or otherwise depositing polymeric and metallic thin and thick films, and by lithographically defining apertures and patterns on such films, transducers can be fully packaged prior to the final dicing steps that would separate the packaged transducers from each other. In the case of microfabricated ultrasonic transducers, such packaging layers can also enable flexible transducers and eliminate or curtail the acoustic cross-coupling that can occur between array elements.

REFERENCES:
patent: 4281550 (1981-08-01), Erikson
patent: 4656384 (1987-04-01), Magori
patent: 4992692 (1991-02-01), Dias
patent: 6014898 (2000-01-01), Finsterwald et al.
patent: 6049159 (2000-04-01), Barthe et al.

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