Method of and apparatus for treating waste gas from semiconducto

Gas separation – Means within gas stream for conducting concentrate to collector

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55 62, 55 74, 55271, 55312, 55314, 55387, B01D 5304

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049062573

ABSTRACT:
A method of and apparatus for treating waste gas from semiconductor manufacturing equipment with a dry solid absorbent. A bypass pipe which is equipped with a bypass valve is provided between inlet and outlet pipes of a container packed with the absorbent, and when a reaction chamber of the semiconductor manufacturing equipment is evacuated to a level below that of atmospheric pressure, the bypass valve is opened to prevent the large amount of non-toxic gas that is discharged from the reaction chamber during the evacuation from being fed to the absorbent-packed container. Large variations in the flow rate of the gas are thus avoided and safe and efficient waste gas treatment with a dry solid absorbent having a relatively small particle diameter is possible.

REFERENCES:
patent: 1677804 (1928-07-01), Thayer
patent: 3545500 (1970-12-01), Bovio
patent: 3775949 (1973-12-01), Wachter
Plant and Process, Kogyo Tchosaki Publishing Co., Ltd., Jul. 1986, vol. 28, No. 7, index and pp. 22-23.
Plant and Process Kogyo Tchosaki Publishing Co., Ltd., Aug. 1986, vol. 28, No. 8, index and pp. 22-23 and pp. 40-49.
Odorous Compounds and Hydrocarbons Control Methods, Environmental Protection Technical Series, Ed. by the Society of Chemical Engineers, Japan, 11/15/77.

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