Method of and apparatus for the radio frequency sputtering of a

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204298, C23C 1500

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active

040438899

ABSTRACT:
A method of an apparatus for controlling the deposition of a thin film upon a substrate by a radio frequency (RF) sputtering apparatus is disclosed. The apparatus utilizes the predetermined bias voltage vs. vacuum pressure characteristic of the RF sputtering apparatus to control, by a single pressure controller, both the vacuum pressure and the bias voltage. A substrate tuning bias circuit generates an effective DC bias voltage that is determined by the RF impedance of the substrate holder to ground. Through a voltage level shifting circuit, a detected change in the DC bias voltage, e.g., a decrease, causes the pressure controller to adjust, e.g., increase, the vacuum pressure. The change in the vacuum pressure then produces a corresponding adjustment, e.g., an increase, of the bias voltage to stabilize the bias voltage back at a predetermined level.

REFERENCES:
patent: 3423303 (1969-01-01), Davidse et al.
patent: 3525680 (1970-08-01), Davidse et al.
patent: 3763031 (1973-10-01), Scow et al.
patent: 3767551 (1973-10-01), Lang, Jr. et al.
patent: 3860507 (1975-01-01), Vossen, Jr.

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