Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-04-19
2005-04-19
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Reexamination Certificate
active
06881595
ABSTRACT:
Electronic circuits or the parts thereof on printed circuit boards are tested by detecting infrared radiation emitted by the surface of the circuit. The detected radiation is converted to data that represent a surface structure and/or depth structure of the circuit. Deviation between the data representing the detected surface structure and/or depth structure and data representing the desired stated of the surface structure and/or depth structure are determined.
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Feldmann et al., “Herausforderung Qualität-Prüfstrategien im Wandel: Durchblick im optischen Test,”Die Fachzeitschrift fär Elektronik-Ferigung und Test, 1997, pp. 26-28, Heft 1/2.
Lowe Hauptman & Berner LLP
Niebling John F.
Stevenson Andre′ C.
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