Method of and apparatus for surface mounting electronic componen

Details Method of and apparatus for surface mounting electronic componen Method of and apparatus for surface mounting electronic componen

1987-12-11

1989-10-10

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

101127, 2281802, H05K 334

Patent

active

048722618

ABSTRACT:
A means for applying solder paste to surface contact pads on a printed wiring board with a stepped solder stencil is disclosed. The stepped stencil has sections of different thickness. Each stencil section has stencil openings formed therein through which solder is deposited onto the surface contact pads. The individual stencil openings are positioned so paste may be deposited through them on surface contact pads in registration underneath. The stencil sections have different thicknesses so solder can be deposited through all stencil openings of verying size with uniform results. Generally, the smaller sized stencil openings are formed in the thinner stencil sections. When this solder stencil is used it is possible to apply all the solder needed, to bond both standard component leads and fine pitch components in a single pass. Multiple solder applications and multiple vapor phase curing associated with surface mounting techniques, are eliminated.

REFERENCES:
patent: 4084506 (1978-04-01), Nakatani
patent: 4270465 (1981-06-01), Lim
patent: 4311267 (1982-01-01), Lim
patent: 4733813 (1988-03-01), LeMeau et al.
IBM Tech. Discl. Bull., vol. 28, No. 2, Jul. 1985, pp. 627-628.

Affiliated with

Also associated with

Rating

Method of and apparatus for surface mounting electronic componen does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and apparatus for surface mounting electronic componen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and apparatus for surface mounting electronic componen will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1934680