Method of and apparatus for shrinking an envelope around a stack

Details Method of and apparatus for shrinking an envelope around a stack Method of and apparatus for shrinking an envelope around a stack

1983-12-28

1986-01-07

Sipos, John

Package making

Methods

With contents treating

53442, 53449, 53512, 53557, 53170, B65B 3100, B65B 1158, B65B 5306

Patent

active

045626898

ABSTRACT:
In order to package a stack of goods in an envelope of heat-shrinkable plastic material such as polyethylene, with prevention of adhesion between the envelope and the goods which may themselves be wrapped in similar sheet material, the stack is placed on a pallet and is covered by the envelope whose lower rim is clamped between the legs of the pallet and an apertured supporting surface such as an upper run of a chain conveyor. The envelope is then inflated from below, by way of the supporting surface, with a low-temperature gas such as ambient air, to establish significant clearances between the stack and the inner surface of the envelope which is then thermally shrunk around the stack by training jets of hot gas onto its outer surface. In zones where the envelope is in contact with the stack, as along edges of the latter, the heating intensity may be reduced to avoid fusion with individual wrappings.

REFERENCES:
patent: 3522688 (1970-08-01), Kaliwoda
patent: 3717939 (1973-02-01), Mitchell
patent: 3826017 (1974-07-01), Kostur
patent: 4132048 (1979-01-01), Day
patent: 4164111 (1979-08-01), DiBernardo
patent: 4314141 (1982-02-01), Vangsted
patent: 4471599 (1984-09-01), Mugnai

Affiliated with

Also associated with

Rating

Method of and apparatus for shrinking an envelope around a stack does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and apparatus for shrinking an envelope around a stack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and apparatus for shrinking an envelope around a stack will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-106377