METHOD OF AND APPARATUS FOR PROTECTING THIN COPPER FOIL AND...

Details METHOD OF AND APPARATUS FOR PROTECTING THIN COPPER FOIL AND... METHOD OF AND APPARATUS FOR PROTECTING THIN COPPER FOIL AND...

2005-07-26

2005-07-26

Mayes, Melvin (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S259000, C156S273100, C156S289000

Reexamination Certificate

active

06921451

ABSTRACT:
An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.

REFERENCES:
patent: 3755043 (1973-08-01), Igarashi et al.
patent: 4465538 (1984-08-01), Schmoock
patent: 4569879 (1986-02-01), Groves
patent: 4818576 (1989-04-01), Pennace et al.
patent: 5057372 (1991-10-01), Imfeld et al.
patent: 5120590 (1992-06-01), Savage et al.
patent: 5948526 (1999-09-01), Wilheim et al.
patent: 6280851 (2001-08-01), Pasternack et al.

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