Method of and apparatus for plating using controlled progressive

Details Method of and apparatus for plating using controlled progressive Method of and apparatus for plating using controlled progressive

1982-07-27

1985-08-27

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 15, 204 46G, 204225, C25D 504, C25D 1700, C25D 1706

Patent

active

045376638

ABSTRACT:
Gold films (18) of essentially uniform thickness are plated onto respective previously formed palladium films (16) on substrates (10) by loading the substrates into a box plater (20) in opposed relationship to respective anode plates (22). In a plating operation, a plating potential initially is applied across upper end portions of the palladium films (16) and the anode plates (22). The loaded box plater (20) then is lowered into a gold plating bath (28) at a preselected rate to progressively immerse the substrates (10) and the anode plates (22) into the plating bath, such that gold plates onto each palladium film (16) to an essentially uniform thickness. The substrates (10) and anode plates (22) then are left immersed in the plating bath (28) for a total time period dependent upon the desired final thickness of the gold films (18).

REFERENCES:
patent: 1939902 (1933-12-01), Kaul
patent: 2750332 (1956-06-01), Miller
patent: 3388047 (1968-06-01), Higgins
patent: 4028198 (1977-06-01), Tuscher et al.

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