Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1994-03-10
1996-01-02
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 97, 427294, 427305, 4274431, B05D 512
Patent
active
054806755
ABSTRACT:
An apparatus for plating a printed circuit board including a non-through hole for connecting between a surface conductive layer and an interlayer wiring layer has a jig, a vessel, a supporting body carrying the jig for causing it to vibrate and swing in a plating liquid contained in the vessel, and a vacuum pump connected to the vessel for exhausting the air in the vessel thereby enhancing removal of bubbles in the non-through hole. A method of plating a printed circuit board includes the step of reducing the pressure inside the vessel simultaneously with the printed circuit board being subjected to the vibration and swinging actions thereby to remove a bubble existing inside the non-through hole. The removal of the bubble makes it possible to have a uniform plating film formed in an inner wall of the non-through hole and ensures the reliable electric connection to be established through the non-through hole between a surface conductive layer and interlayer conductive layers.
REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 3934054 (1976-01-01), Schmeling
patent: 4477484 (1984-10-01), Paoletti
patent: 4622917 (1986-11-01), Schramm
patent: 4734296 (1988-03-01), Schramm
patent: 4938853 (1990-07-01), Retallick
patent: 5077099 (1991-12-01), Kukanskis
English translation of Japanese Patent No. 12877.
Joseph J. D'Ambrisis et al "The Chemistry of Plating Small Diameter Holes--Part I", Apr., 1989 PC FAB.
Joseph J. D'Ambrisis et al "The Chemistry of Plating Small Diameter Holes--Part II", Aug. 1989 PC FAB.
Maniwa Ryo
Murakami Tomoo
Ohnuki Hidebumi
Tsunoda Takanori
Beck Shrive
Maiorana David M.
NEC Corporation
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