Method of and apparatus for packaging chip components

Details Method of and apparatus for packaging chip components Method of and apparatus for packaging chip components

1986-06-20

1988-06-28

Coan, James F.

Package making

Methods

Filling preformed receptacle and closing

53281, 53493, 53559, B65B 1150

Patent

active

047530618

ABSTRACT:
A method of loading chip components orientation-specific into a carrier tape that itself comprises a narrow strip of diaphanous material having a series of depressions embossed therein comprising the steps of moving a series of open-ended recesses, sized and shaped to receive a single chip component in a specific orientation, upwardly through a loose mass of chip components at a speed that is continually interrupted with real time pauses and ultimately transferring the chip components into conjunctive registry with the tape embossments and an apparatus therefor.

REFERENCES:
patent: 3038282 (1962-06-01), Hansen et al.
patent: 3284984 (1966-11-01), Cloud
patent: 3656604 (1972-04-01), Sterling
patent: 3695414 (1972-10-01), Wiesler et al.
patent: 3846956 (1974-11-01), Johnson
patent: 4479573 (1984-10-01), Ackley, Sr. et al.
patent: 4571924 (1986-02-01), Bahrani

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