Method of and apparatus for mounting electronic parts on a board

Details Method of and apparatus for mounting electronic parts on a board Method of and apparatus for mounting electronic parts on a board

1997-09-15

1998-11-24

Picardat, Kevin

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438 14, H01L 2166

Patent

active

058405941

ABSTRACT:
A first camera detects a positional relationship among first, second and third nozzles. A second camera detects pick-up positions of chips in parts feeders. Tolerance zones for the respective chips are determined, within which the nozzle can pick up the chip. When one of nozzles is placed in the corresponding pick-up position, it is judged whether or not other nozzles are located within the corresponding tolerance zones, respectively. If the judgment result is "YES", the nozzles pick up the chips simultaneously , and if this result is "NO", the nozzles pick up the chips separately.

REFERENCES:
patent: 5059559 (1991-10-01), Takahashi et al.
patent: 5324381 (1994-06-01), Nishiguchi
patent: 5444388 (1995-08-01), Ideta et al.
patent: 5549716 (1996-08-01), Takahashi et al.

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