Method of and apparatus for manufacturing semiconductor device

Details Method of and apparatus for manufacturing semiconductor device Method of and apparatus for manufacturing semiconductor device

1992-11-10

1994-03-15

Bradley, Paula A.

Metal fusion bonding

Process

Plural joints

228 45, 228 8, B23K 3102

Patent

active

052940381

ABSTRACT:
This invention relates to an apparatus for manufacturing a semiconductor device, which has an auxiliary bonding stage in the vicinity of a wafer stage so that when a wire is disconnected during a bonding operation of a ball bump by wire bonding, the wire can be easily restored to the normal state without using an IC chip on a wafer, and a method of manufacturing a semiconductor device, which comprises the steps of moving a capillary above the auxiliary bonding stage after wire disconnection occurs, pulling out the wire from the capillary above the auxiliary bonding stage, forming a ball at a distal cut end of the wire which is pulled out, and performing ball bump bonding on an electrode of an IC chip placed on the wafer stage with the wire formed with the ball at its distal cut end.

REFERENCES:
patent: 4422568 (1983-12-01), Elles et al.
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4549059 (1985-10-01), Kamijo et al.
patent: 4594493 (1986-06-01), Harrah et al.
patent: 4877173 (1989-10-01), Fujimoto et al.
patent: 5193738 (1993-03-01), Hayes

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