Method of and apparatus for manufacturing electronic component

Details Method of and apparatus for manufacturing electronic component Method of and apparatus for manufacturing electronic component

1993-11-29

1994-11-15

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228254, 228 495, 118226, 427123, 4273837, H01G 1300, H01C 1700

Patent

active

053640144

ABSTRACT:
A component body is held by a holder while projecting both end portions thereof respectively, and two applicators are simultaneously approached toward related end portions of the component body. The applicators are provided with paste films respectively, so that the respective end portions of the component body are located in the paste films as the result of the aforementioned approaching. Then, the applicators are separated from the component body, so that the component body coated with paste materials on the both end portions can be obtained. Conductor paste materials can be efficiently applied to the both end portions of the component body, while the widths of the conductor paste materials which are applied onto the both end portions can be made equal to each other.

REFERENCES:
patent: 4607782 (1986-08-01), Mims
patent: 4766844 (1988-08-01), Brewer et al.
patent: 5216573 (1993-06-01), Kulkarni

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