Method of and apparatus for machining printed circuit board

Details Method of and apparatus for machining printed circuit board Method of and apparatus for machining printed circuit board

1989-02-28

1992-06-23

Schwartz, Larry I.

Cutting by use of rotating axially moving tool

Processes

Bit detachable

408 95, 408 16, 408 10, 408 13, B23B 3500

Patent

active

051237890

ABSTRACT:
A method of and apparatus for effecting a machining operation, e.g. drilling, on a multi-layered printed circuit board utilizing a machining apparatus having a spindle for driving a tool. The spindle is movable in the axial direction of the tool and a pressure foot for pressing the printed circuit board during the machining is mounted on the spindle for relative movement with respect thereto. The method includes the steps of determining the position of the end of a tool with respect to the end of a pressure foot in the state before the pressure foot contacts the printed circuit board, setting the amount of relative movement between the pressure foot and the tool necessary for effecting the desired machining, on the basis of the position of the end of the tool and a predetermined set value of the machining depth; and effecting the machining on the printed circuit board by controlling the feed of the tool in conformity with the amount of relative movement.

REFERENCES:
patent: 4340326 (1982-07-01), Buonauro
patent: 4596500 (1986-06-01), Raiteri
patent: 4717291 (1988-01-01), Zafir
patent: 4725172 (1988-02-01), Shiina
patent: 4745557 (1988-05-01), Pekar et al.
patent: 4765784 (1988-03-01), Karwan
patent: 4786216 (1988-11-01), Kitagawa et al.
patent: 4865494 (1989-09-01), Gudow

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