Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1996-02-23
1998-05-26
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438691, 257700, H01L 2160
Patent
active
057563780
ABSTRACT:
The disclosure relates to spot-facing for exposing an inner-layer conductor embedded in an insulator of a printed circuit board. The spot-facing removes the entire insulator by a mechanical cutter, except a part thereof, to a position just above the inner-layer conductor. The part of the insulator is smaller in thickness than the insulator removed by the mechanical cutter. Then, the remaining part of the insulator is removed by scanning the part with a laser beam to expose the inner-layer conductor. The laser beam is in a slender shape almost perpendicular to the scanning direction of the laser beam and has an almost uniform energy density along the slender shape. Cutter processing is sufficient to be done before the inner-layer conductor, and there is no fear of damaging the inner-layer conductor. Moreover, laser-beam processing is easy to control thermal influence on the portion to be processed of the circuit board, because the energy density of the laser beam is almost uniform. Therefore, the product yield according to the processing is improved.
REFERENCES:
patent: 4323755 (1982-04-01), Nierenberg
patent: 4504727 (1985-03-01), Melcher et al.
patent: 4644130 (1987-02-01), Bachmann
patent: 4673409 (1987-06-01), Van Kampen
patent: 5010232 (1991-04-01), Arai et al.
patent: 5483100 (1996-01-01), Marrs et al.
Hitachi Seiko Ltd.
Niebling John
Turner Kevin F.
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