Method of and apparatus for detecting a defect at the outer...

Details Method of and apparatus for detecting a defect at the outer... Method of and apparatus for detecting a defect at the outer...

2005-03-15

2005-03-15

Stafira, Michael P. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

C073S781000

Reexamination Certificate

active

06867855

ABSTRACT:
Apparatus for detecting a defect in the outer peripheral edge of a wafer includes a rotary mechanism by which the wafer can be rotated, a wafer edge contact device, and a controller. The wafer edge contact device includes a string that is pressed against the edge of the wafer. One end of the string is fixed in place, and a sensor is operatively associated with the other end of the string so as to sense movement of the other end of the string. This other end of the string will be pulled by a defect at the outer peripheral edge of the wafer when the wafer is rotated. Thus, a defective edge of the wafer can be detected before/after the wafer is processed. Accordingly, the wafer can be prevented from being further damaged, wafer particles are prevented from polluting the fabricating equipment, and the operating efficiency and productivity of the fabricating equipment are enhanced.

REFERENCES:
patent: 4409087 (1983-10-01), Quick
patent: 5690744 (1997-11-01), Landau
patent: 5970807 (1999-10-01), Hsu et al.
patent: 6101868 (2000-08-01), Hung et al.

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