Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1992-03-16
1993-09-21
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427355, 427360, 427369, 427424, C23C 2600
Patent
active
052467317
ABSTRACT:
A method and apparatus for depositing solder on the terminal pads of printed circuit boards in which a solder resist layer or layers having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir is directed by nozzles against the sides of the board to fill the cavities extending above the terminal pads while the board is moving via a conveyor mechanism relative to the reservoir. The cavities when filled with molten solder are covered by a suitable element such as a flexible belt or roller. The molten solder within the covered cavities is then cooled below its solidification point and the covering element removed. If desired, part or all of the solder resist layer or layers may then be stripped from the board to leave solder pads extending above the surface of the board.
REFERENCES:
patent: 4127692 (1978-11-01), Boynton
patent: 4493857 (1985-01-01), Knigge
patent: 4720324 (1988-01-01), Hayward
Beck Shrive
Dang Vi Duong
Jackson Harold L.
Velie Circuits, Inc.
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