Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1994-02-02
1995-03-07
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427282, 118210, 118213, 118239, B05D 100
Patent
active
053956435
ABSTRACT:
Solder is deposited on a printed circuit board by melting the solder in a container. The container has a slot for passage of solder, therethrough and control means actuable to alternately allow and prevent passage of solder through the slot. The slot is placed in contact with a stencil and the control means is actuated to allow passage of solder through the slot. The stencil is moved relative to the container in a direction transverse of the slot to deposit solder on the printed circuit board via the stencil.
REFERENCES:
patent: 4515297 (1985-05-01), Schoenthaler
patent: 4604966 (1986-08-01), Kohn
patent: 4622239 (1986-11-01), Schoenthafer
patent: 4649817 (1987-03-01), Smith
patent: 4720402 (1988-01-01), Wojcik
patent: 4722470 (1988-02-01), Johary
patent: 4872261 (1989-10-01), Sanyal et al.
patent: 4898117 (1990-02-01), Ledermann
patent: 4938994 (1990-07-01), Choinski
patent: 5104689 (1992-04-01), Hayden
IBM TDB, vol. 33, No. 12, May 1991, p. 144, "Via Fill with Molten Solder".
Brown John
McNee James
Murray Kenneth
Robertson Brian
Beck Shrive
Dang Vi Duong
International Business Machines - Corporation
McBurney Mark E.
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