Method of and apparatus for chemical mechanical polishing...

Details Method of and apparatus for chemical mechanical polishing... Method of and apparatus for chemical mechanical polishing...

2005-08-16

2005-08-16

Hassenzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C156S345130

Reexamination Certificate

active

06929755

ABSTRACT:
The distribution and size distribution of polishing particles contained in a slurry to be supplied to a polishing unit are measured by a measuring machine. Polishing speed with respect to a wafer is controlled to be constant by controlling a physical quantity such as the rotation speed of a polishing surface plate, the rotation speed of a polishing head or the pressurizing force of the polishing head based on the measurement result.

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