Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1984-12-03
1986-10-28
Wityshyn, Michael
Metal fusion bonding
Process
Using high frequency vibratory energy
156 732, 1565801, 228 11, 228 45, 228 13, B23K 2010, B23K 3102
Patent
active
046193979
ABSTRACT:
A method and an apparatus for bonding a thin electrically conductive wire, especially an aluminum wire (11), to electrical bonding pads or areas (12, 14) of electric or electronic components (16), especially microchips or semiconductor components. To this end the wire (11) is briefly pressed against the bonding pad (12, 14) by means of an ultrasonically energized bonding wedge (10) and is subsequently severed at a small distance from the side (17) of the wedge (10) that is opposite to the wire feeding side (15) thereof. To prevent the formation of a wire tail (TL) protruding beyond the bonding length (BL), a wire clamping tool (21) is provided on the wire feeding side of the wedge (10) by means of which the wire (11), after having been severed and prior to another bonding operation, is moved back, preferably retracted, at least to such an extent that the free wire end is approximately flush with the side (17) of the wedge (10) which is opposite to the wire feeding side (15 ) thereof.
REFERENCES:
patent: 3444612 (1969-05-01), Pennings
patent: 3627192 (1971-12-01), Killingsworth
patent: 3659770 (1972-05-01), Miller
patent: 3747198 (1973-07-01), Benson et al.
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