Method of and apparatus for automatic high-speed optical inspect

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

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G01N 2100

Patent

active

060914882

ABSTRACT:
Semiconductor wafers, circuit boards and similar multi-layer structures are optically inspected at high speeds with the aid of preferably a pair of oppositely and inclinedly directed laser beams at inclined angles to the vertical and the wafer surface to cause fluorescence by a photoresist layer carrying conductor patterns, defects in which are to be inspected, and using preferably a time-delay-integration CCD imaging camera for recording a fluorescent resist surface image accentuating the non-fluorescing conductor pattern thereupon, while masking all light from layers therebelow.

REFERENCES:
patent: 5278012 (1994-01-01), Yamanaka et al.
patent: 5951837 (1999-09-01), Craig et al.

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