Method of and apparatus for applying solder to metallic blanks

Details Method of and apparatus for applying solder to metallic blanks Method of and apparatus for applying solder to metallic blanks

1978-12-01

1980-10-28

Husar, Francis S.

Metal fusion bonding

Process

Feeding unfused filler into fusing contact with work part

118 59, 228 41, 228 46, 228 47, 427 11, 427123, 427319, B23K 102

Patent

active

042302579

ABSTRACT:
A method of and apparatus for applying beads of solder to a metallic plate as an integral part thereof for subsequent attachment to another component in an assembly operation.

REFERENCES:
patent: 1749719 (1930-03-01), Reiter et al.
patent: 2407208 (1946-09-01), Sherwood
patent: 2685268 (1954-08-01), Yeo et al.
patent: 3283987 (1966-11-01), Kauffman
patent: 3940046 (1976-02-01), Fern

Affiliated with

Also associated with

Rating

Method of and apparatus for applying solder to metallic blanks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and apparatus for applying solder to metallic blanks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and apparatus for applying solder to metallic blanks will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-264300