Method of and an apparatus for slicing a single crystal ingot us

Details Method of and an apparatus for slicing a single crystal ingot us Method of and an apparatus for slicing a single crystal ingot us

1991-09-13

1994-05-24

Rose, Robert A.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

5116587, 51 73R, 125 1302, B24B 4916, B28D 104

Patent

active

053137418

ABSTRACT:
An improved method of using an ID saw slicing machine for slicing a single crystal ingot in a direction normal to the axis of the ingot to obtain wafers, of which the improvement lies in that the cutting load which the blade of the ID saw slicing machine imposes upon the single crystal ingot is continually detected in terms of three vector elements along three mutually perpendicular directions throughout the slicing operation, and that, when the magnitude of that vector element of the cutting load which extends in the slicing direction exceeds a predetermined value, the feed rate of the ingot to the blade is decreased and, at the same time, the rotational speed of the blade is increased in accordance with a predetermined control pattern.

REFERENCES:
patent: 4228782 (1980-10-01), Demers et al.
patent: 4653361 (1987-03-01), Zobeli
patent: 4991475 (1991-02-01), Malcok et al.
patent: 5000156 (1991-03-01), Honda et al.
patent: 5025593 (1991-06-01), Kawaguchi et al.

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