Method of, and a machine for, electroplating

Chemistry: electrical and wave energy – Processes and products

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Details

204224R, C25D 502, C25D 1706

Patent

active

044540094

ABSTRACT:
There is provided, in a method of selective electroplating, the improvement comprising the utilization of a highly conductive electrolyte, compatible with the plating electrolyte but containing no depositable metallic ions, to form the cathode connection to the components to be plated and, in a machine for electroplating components, the improvement comprising providing the cathode connection to the components to be plated through the intermediary of a highly conductive electrolyte compatible with the plating electrolyte but containing no depositable metallic ions.

REFERENCES:
patent: 2861936 (1958-11-01), Colasanto
patent: 3658663 (1972-04-01), Fukanuma
patent: 4043894 (1977-08-01), Gibbs
patent: 4302316 (1981-11-01), Nester

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